The overall rating is based on review by our experts
The MediaTek Dimensity 1200 Max is a high-performance SoC designed for premium smartphones, offering enhanced features and superior performance. Announced in 2021, this chipset is built on a 6-nanometer process technology, which ensures excellent power efficiency and robust performance across a range of applications, including gaming, multimedia, and AI-driven tasks.
The Dimensity 1200 Max features an octa-core CPU configuration with one ultra-core ARM Cortex-A78 clocked at up to 3.0 GHz, three super-core Cortex-A78 cores at 2.6 GHz, and four power-efficient Cortex-A55 cores at 2.0 GHz. This configuration delivers top-tier performance for demanding tasks while optimizing power consumption for everyday use.
For graphics, the Dimensity 1200 Max integrates the Mali-G77 MP11 GPU, providing exceptional performance for gaming and high-definition multimedia. The GPU supports advanced graphics features and high frame rates, ensuring a smooth and immersive visual experience.
The chipset also boasts advanced AI capabilities with MediaTek’s APU 3.0, which enhances various AI-driven applications such as real-time image processing, voice recognition, and intelligent camera features.
See also: MediaTek Dimensity 1200
| Device Type | Mobile Platform |
| Model |
Dimensity 1200 Max CPH2293 |
| Announced | February 2022 |
| CPU |
1x Cortex-A78 @ 3.00 GHz 3x Cortex-A78 @ 2.60 GHz 4x Cortex-A55 @ 2.00 GHz |
| GPU | ARM Mali-G77 MP11 @ 950 MHz |
| Process | 6nm |
| Core | 8-Core |
| Max Camera Resolution | 1x 200MP, 2x 32MP |
| RAM Type | LPDDR4X up to 16 GB |
| RAM Frequency | 2133 MHz |
| Storage Type | UFS 3.1 |
| Resolution | 2400 × 1080 |
| Display Type | Full HD |
| Score | 795097 |
| Single core | 1470 |
| Multi core | 4564 |
| 5G Support | |
| Modem | Helio M70 |
| AI | MediaTek APU 3.0 |
| Charging | Fast Charging Support |
| Bluetooth | 5.2 |
| Wi-Fi | 6 |
| NFC | |
| GPS | |
| FM Radio |