MediaTek Dimensity 8050 vs HiSilicon Kirin 990 5G
|
|
| Price | ₹99.00 ₹90.00 |
| Our Rating | |
| Brand | MediaTek HiSilicon |
| Category | Smartphone Processors Smartphone Processors |
General
| Device Type | Mobile Platform Mobile Platform |
| Model |
Dimensity 8050 MT6893 Kirin 990 5G |
| Announced | May 9, 2023 October 6, 2019 |
CPU & GPU
| CPU |
1x Cortex-A78 @ 3.0 GHz 3x Cortex-A78 @ 2.6 GHz 4x Cortex-A55 @ 2.0 GHz 2x Cortex-A76 @ 2.86 GHz 2x Cortex-A76 @ 2.36 GHz 4x Cortex-A55 @ 1.95 GHz |
| GPU | ARM Mali-G77 MP9 @ 850 MHz ARM Mali-G76 MP16 @ 600 MHz |
| Process | 6nm 7nm |
| Core | 8-core 8-Core |
Camera
| Max Camera Resolution | 1x 200MP 1x 64MP |
RAM & Storage
| RAM Type | LPDDR4X up to 16 GB LPDDR4X up to 12 GB |
| RAM Frequency | 2133 MHz 2133 MHz |
| Storage Type |
UFS 3.1
UFS 2.1 UFS 3.0 |
Display
| Resolution | 2520 x 1080 3360 x 1440 |
| Display Type |
HD+ | QHD+
4K UHD Full HD+ |
AnTuTu
| Score | 752312 560795 |
Geekbench
| Single core | 1097 766 |
| Multi core | 3359 3061 |
Network
| 5G Support | |
| Modem |
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA Balong 5000 5G modem 4G support LTE Cat. 21 |
Additional Features
| AI |
MediaTek APU 570
HUAWEI Da Vinci Architecture 2x Ascend Lite + 1x Ascend Tiny HiAI 2.0 |
| Charging | Fast charging support Fast Charging Support |
| Bluetooth | 5.2 5.0 |
| Wi-Fi | 6 6 |
| NFC | |
| GPS | |
| FM Radio |
|