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Dimensity 7025 vs Snapdragon 888 Plus
We have assessed two 8-core mobile processors: MediaTek Dimensity 7025 and Qualcomm Snapdragon 888 Plus. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.
General
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Device Type
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Mobile Platform
Mobile Platform
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Model
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Dimensity 7025
Snapdragon 888 Plus SM8350-AC
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Announced
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April 10, 2024
June 28, 2021
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CPU & GPU
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CPU
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2x Cortex-A78 @ 2.5 GHz 6x Cortex-A55 @ 2.0 GHz
1x Kryo 680 Prime (Cortex-X1) @ 2.995 GHz 3x Kryo 680 Gold (Cortex-A78) @ 2.42 GHz 4x Kryo 680 Silver (Cortex-A55) @ 1.8 GHz
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GPU
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IMG BXM-8-256 @ 950 MHz
Adreno 660 @ 905 MHz
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Process
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6nm
5nm
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Core
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8-core
8-Core
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Camera
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Max Camera Resolution
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1x 200MP
1x 200MP, 2x 25MP
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RAM & Storage
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RAM Type
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LPDDR5 up to 16 GB
LPDDR5 up to 24 GB
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RAM Frequency
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3200 MHz
3200 MHz
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Storage Type
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UFS 2.2, UFS 3.1
UFS 3.0 UFS 3.1
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Display
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Resolution
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2520 x 1080
3840 x 2160
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Display Type
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Full HD+ @ Refresh Rate 120Hz
4K Full HD+
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Geekbench
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Single core
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1024
1750
|
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Multi core
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2472
3987
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Network
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5G Support
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|
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Modem
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2G-5G Multi-Mode 5G Carrier Aggregation (CA), 5G FDD / TDD 4G Carrier Aggregation (CA) 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM
Snapdragon X60
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Additional Features
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AI
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Mediatek NPU
Hexagon 780
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Charging
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Fast charging support
Quick Charge 5.0 technology
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Bluetooth
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5.3
5.2
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Wi-Fi
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5
6
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NFC
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GPS
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FM Radio
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