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Snapdragon 8s Gen 3 vs Dimensity 7050
We have analyzed two 8-core mobile processors: Qualcomm Snapdragon 8s Gen 3 and MediaTek Dimensity 7050. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
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Device Type
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Mobile Platform
Mobile Platform
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Model
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Snapdragon 8s Gen 3 SM8650
Dimensity 7050
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Announced
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March 18, 2024
May 2, 2023
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CPU & GPU
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CPU
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1x Cortex-X4 @ 3.0 GHz 4x Cortex-A720 @ 2.8 GHz 3x Cortex-A520 @ 2.0 GHz
2x Cortex-A78 @ 2.6 GHz 6x Cortex-A55 @ 2 GHz
|
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GPU
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Adreno 700 @ 1100 MHz
Arm Mali-G68 MP4 @ 800 MHz
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Process
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4nm
TSMC 6nm
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Core
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8-core
8-core
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Camera
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Max Camera Resolution
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1x 200MP
1x 200MP
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RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR5 up to 16 GB
|
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RAM Frequency
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4200 MHz
2750 Mhz
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|
Storage Type
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UFS 4.0
UFS 3.1 UFS 2.1
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Display
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Resolution
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3840 x 2160
2520 x 1080
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Display Type
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HDR Vivid, HDR10, HDR10+
Full HD+ @ 120Hz Refresh rate
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Geekbench
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Single core
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2019
840
|
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Multi core
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5570
2300
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Network
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5G Support
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|
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Modem
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Snapdragon X70
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
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Additional Features
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AI
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Qualcomm Hexagon NPU
MediaTek APU 550
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Charging
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Qualcomm Quick Charge 5 technology
Fast charging support
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Bluetooth
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5.4
5.2
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Wi-Fi
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7
6 (a/b/g/n/ac/ax)
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NFC
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|
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GPS
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|
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FM Radio
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