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Snapdragon 8s Gen 3 vs Dimensity 700
We have assessed two 8-core mobile processors: Qualcomm Snapdragon 8s Gen 3 and MediaTek Dimensity 700. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.
General
|
Device Type
|
Mobile Platform
Mobile Platform
|
|
Model
|
Snapdragon 8s Gen 3
SM8650
Dimensity 700
MT6833V/ZA
|
|
Announced
|
March 18, 2024
November 10, 2020
|
CPU & GPU
|
CPU
|
1x Cortex-X4 @ 3.0 GHz
4x Cortex-A720 @ 2.8 GHz
3x Cortex-A520 @ 2.0 GHz
2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
|
|
GPU
|
Adreno 700 @ 1100 MHz
ARM Mali-G57 MP2 @ 950 MHz
|
|
Process
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4nm
7nm
|
|
Core
|
8-core
8-core
|
Camera
|
Max Camera Resolution
|
1x 200MP
1x 64MP, 2x 16MP
|
RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR4X up to 12 GB
|
|
RAM Frequency
|
4200 MHz
2133 MHz
|
|
Storage Type
|
UFS 4.0
UFS 2.2
|
Display
|
Resolution
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3840 x 2160
2520 x 1080
|
|
Display Type
|
HDR Vivid, HDR10, HDR10+
Full HD+
|
Geekbench
|
Single core
|
2019
711
|
|
Multi core
|
5570
1783
|
Network
|
5G Support
|
|
|
Modem
|
Snapdragon X70
Integrated 5G Modem
4G support LTE Cat. 18
|
Additional Features
|
AI
|
Qualcomm Hexagon NPU
Yes
|
|
Charging
|
Qualcomm Quick Charge 5 technology
Fast Charging Support
|
|
Bluetooth
|
5.4
5.1
|
|
Wi-Fi
|
7
5
|
|
NFC
|
|
|
GPS
|
|
|
FM Radio
|
|
