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Snapdragon 7 plus Gen 3 vs Dimensity 8250
We have evaluated two 8-core mobile processors, Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 8250. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Snapdragon 7 Plus Gen 3 SM7675
Dimensity 8250
|
Announced
|
March 21, 2024
May 13, 2024
|
CPU & GPU
CPU
|
1x Cortex-X4 @ 2.8 GHz 4x Cortex-A720 @ 2.6 GHz 3x Cortex-A520 @ 1.9 GHz
1x Cortex-A78 @ 3.1 GHz 3x Cortex-A78 @ 3.0 GHz 4x Cortex-A55 @ 2.0 GHz
|
GPU
|
Adreno 732 @ 950 MHz
Arm Mali-G610 MP6 @ 950 MHz
|
Process
|
4nm
TSMC 4nm
|
Core
|
8-core
8-core
|
Camera
Max Camera Resolution
|
1x 200MP
1x 320MP, 3x 32MP
|
RAM & Storage
RAM Type
|
LPDDR5X up to 24 GB
LPDDR5 up to 16 GB
|
RAM Frequency
|
4200 MHz
6400 MHz
|
Storage Type
|
UFS 4.0
UFS 3.1
|
Display
Resolution
|
3840 x 2160
2960 x 1440
|
Display Type
|
WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+ @ up to 180Hz WQHD @ up to 120Hz
|
Geekbench
Single core
|
1913
1384
|
Multi core
|
5098
4091
|
Network
5G Support
|
|
Modem
|
Snapdragon X63
3GPP Release 16 5G Modem MediaTek UltraSave 2.0 3CC Carrier Aggregation (200MHz) 5G sub-6GHz 4G support LTE Cat. 21
|
Additional Features
AI
|
Qualcomm Hexagon™ NPU
MediaTek APU 580
|
Charging
|
Qualcomm Quick Charge 5 Technology
120W Fast charging support
|
Bluetooth
|
5.4
5.3
|
Wi-Fi
|
7
6E
|
NFC
|
|
GPS
|
|
FM Radio
|
|