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Snapdragon 7 plus Gen 3 vs Dimensity 7050
We have analyzed two 8-core mobile processors: Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 7050. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
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Device Type
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Mobile Platform
Mobile Platform
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Model
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Snapdragon 7 Plus Gen 3 SM7675
Dimensity 7050
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Announced
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March 21, 2024
May 2, 2023
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CPU & GPU
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CPU
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1x Cortex-X4 @ 2.8 GHz 4x Cortex-A720 @ 2.6 GHz 3x Cortex-A520 @ 1.9 GHz
2x Cortex-A78 @ 2.6 GHz 6x Cortex-A55 @ 2 GHz
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GPU
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Adreno 732 @ 950 MHz
Arm Mali-G68 MP4 @ 800 MHz
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Process
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4nm
TSMC 6nm
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Core
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8-core
8-core
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Camera
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Max Camera Resolution
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1x 200MP
1x 200MP
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RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR5 up to 16 GB
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RAM Frequency
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4200 MHz
2750 Mhz
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Storage Type
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UFS 4.0
UFS 3.1 UFS 2.1
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Display
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Resolution
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3840 x 2160
2520 x 1080
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Display Type
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WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+ @ 120Hz Refresh rate
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Geekbench
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Single core
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1913
840
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Multi core
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5098
2300
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Network
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5G Support
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|
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Modem
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Snapdragon X63
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
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Additional Features
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AI
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Qualcomm Hexagon™ NPU
MediaTek APU 550
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Charging
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Qualcomm Quick Charge 5 Technology
Fast charging support
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Bluetooth
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5.4
5.2
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Wi-Fi
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7
6 (a/b/g/n/ac/ax)
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NFC
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|
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GPS
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|
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FM Radio
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