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Snapdragon 7 plus Gen 3 vs Dimensity 700
We have assessed two 8-core mobile processors: Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 700. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.
General
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Device Type
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Mobile Platform
Mobile Platform
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Model
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Snapdragon 7 Plus Gen 3 SM7675
Dimensity 700 MT6833V/ZA
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Announced
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March 21, 2024
November 10, 2020
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CPU & GPU
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CPU
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1x Cortex-X4 @ 2.8 GHz 4x Cortex-A720 @ 2.6 GHz 3x Cortex-A520 @ 1.9 GHz
2x Cortex-A76 @ 2.2 GHz 6x Cortex-A55 @ 2.0 GHz
|
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GPU
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Adreno 732 @ 950 MHz
ARM Mali-G57 MP2 @ 950 MHz
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Process
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4nm
7nm
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Core
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8-core
8-core
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Camera
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Max Camera Resolution
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1x 200MP
1x 64MP, 2x 16MP
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RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR4X up to 12 GB
|
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RAM Frequency
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4200 MHz
2133 MHz
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Storage Type
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UFS 4.0
UFS 2.2
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Display
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Resolution
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3840 x 2160
2520 x 1080
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|
Display Type
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WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+
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Geekbench
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Single core
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1913
711
|
|
Multi core
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5098
1783
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Network
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5G Support
|
|
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Modem
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Snapdragon X63
Integrated 5G Modem 4G support LTE Cat. 18
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Additional Features
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AI
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Qualcomm Hexagon™ NPU
Yes
|
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Charging
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Qualcomm Quick Charge 5 Technology
Fast Charging Support
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|
Bluetooth
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5.4
5.1
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|
Wi-Fi
|
7
5
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NFC
|
|
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GPS
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|
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FM Radio
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