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Qualcomm Snapdragon 7 Gen 3 vs MediaTek Dimensity 7200
We have analyzed two 8-core mobile processors: Qualcomm Snapdragon 7 Gen 3 and MediaTek Dimensity 7200. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Snapdragon 7 Gen 3 SM7550-AB
Dimensity 7200
|
Announced
|
November 17, 2023
February 16, 2023
|
CPU & GPU
CPU
|
1x Cortex-A715 @ 2.63 GHz 3x Cortex-A715 @ 2.4 GHz 4x Cortex-A510 @ 1.8 GHz
2x Cortex-A715 @ 2.8 GHz 6x Cortex-A510 @ 2.0 GHz
|
GPU
|
Adreno 720
Arm Mali-G610 MP4 @ 1130 MHz
|
Process
|
4nm
4nm (2nd-Gen TSMC)
|
Core
|
8-core
8-core
|
Camera
Max Camera Resolution
|
1x 200MP
1x 200MP
|
RAM & Storage
RAM Type
|
LPDDR5 up to 16 GB
LPDDR5 up to 16 GB
|
RAM Frequency
|
3200 MHz
3200 MHz
|
Storage Type
|
UFS 3.1
UFS 3.1
|
Display
Resolution
|
3360 x 1600
2520 x 1080
|
Display Type
|
WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+ @ 144Hz
|
Geekbench
Single core
|
1149
1187
|
Multi core
|
3388
2643
|
Network
5G Support
|
|
Modem
|
Snapdragon X63
5G modem MediaTek 5G UltraSave 2.0 technology Downlink performance up to 4.7Gbps and dual 5G SIM 2G-5G Multi-Mode
|
Additional Features
AI
|
Qualcomm Hexagon™ NPU
MediaTek APU 650
|
Charging
|
Qualcomm Quick Charge 5 Technology
Fast Charging Support
|
Bluetooth
|
5.3
5.3
|
Wi-Fi
|
6
6
|
NFC
|
|
GPS
|
|
FM Radio
|
|