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Dimensity 7050 vs Snapdragon 855 Plus
We have evaluated two 8-core mobile processors, MediaTek Dimensity 7050 and Qualcomm Snapdragon 855 Plus. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Dimensity 7050
Snapdragon 855 Plus SM8150-AC
|
Announced
|
May 2, 2023
July 15, 2019
|
CPU & GPU
CPU
|
2x Cortex-A78 @ 2.6 GHz 6x Cortex-A55 @ 2 GHz
1x Cortex-A76 (Kryo 485 Gold) @ 2.96 GHz 3x Cortex-A76 (Kryo 485 Gold) @ 2.42 GHz 4x Cortex-A55 (Kryo 485 Silver) @ 1.8 GHz
|
GPU
|
Arm Mali-G68 MP4 @ 800 MHz
Adreno 640 @ 675 MHz
|
Process
|
TSMC 6nm
7nm
|
Core
|
8-core
8-Core
|
Camera
Max Camera Resolution
|
1x 200MP
1x 192MP, 2x 22MP
|
RAM & Storage
RAM Type
|
LPDDR5 up to 16 GB
LPDDR4X up to 16 GB
|
RAM Frequency
|
2750 Mhz
2133 MHz
|
Storage Type
|
UFS 3.1 UFS 2.1
UFS 3.0
|
Display
Resolution
|
2520 x 1080
3840 x 2160
|
Display Type
|
Full HD+ @ 120Hz Refresh rate
4K Ultra HD+
|
Geekbench
Single core
|
840
1061
|
Multi core
|
2300
3197
|
Network
5G Support
|
|
Modem
|
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Qualcomm Snapdragon X24 LTE X50 5G X50 Modem-RF System 4G support LTE Cat. 20
|
Additional Features
AI
|
MediaTek APU 550
Hexagon 690
|
Charging
|
Fast charging support
Quick Charge 4+ technology
|
Bluetooth
|
5.2
5.0
|
Wi-Fi
|
6 (a/b/g/n/ac/ax)
6
|
NFC
|
|
GPS
|
|
FM Radio
|
|