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MediaTek Dimensity 6300 vs HiSilicon Kirin 820
We have analyzed two 8-core mobile processors: MediaTek Dimensity 6300 and HiSilicon Kirin 820. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
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Device Type
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Mobile Platform
Mobile Platform
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|
Model
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Dimensity 6300
Kirin 820
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|
Announced
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April 19, 2024
March 30, 2020
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CPU & GPU
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CPU
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2x Cortex-A76 @ 2.4 GHz 6x Cortex-A55 @ 2.0 GHz
1x Cortex-A76 @ 2.36 GHz 3x Cortex-A76 @ 2.22 GHz 4x Cortex-A55 @ 1.84 GHz
|
|
GPU
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Arm Mali-G57 MP2 @ 950 MHz
ARM Mali-G57 MP6 @ 850 MHz
|
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Process
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6nm
7nm
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|
Core
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8-core
8-Core
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Camera
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Max Camera Resolution
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1x 108MP, 2x 16MP
1x 48MP, 2x 20MP
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RAM & Storage
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RAM Type
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LPDDR4X up to 12 GB
LPDDR4X up to 12 GB
|
|
RAM Frequency
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2133 MHz
2133 MHz
|
|
Storage Type
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UFS 2.2
UFS 2.1
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Display
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Resolution
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2520 x 1080
3360 x 1440
|
|
Display Type
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Full HD+
Full HD+
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Geekbench
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Single core
|
813
631
|
|
Multi core
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2135
2429
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Network
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5G Support
|
|
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Modem
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2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Integrated 5G Modem Balong 5000 4G support LTE Cat. 22
|
Additional Features
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AI
|
Yes
Da Vinci NPU
|
|
Charging
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Fast charging support
|
|
Bluetooth
|
5.2
5.1
|
|
Wi-Fi
|
5
6
|
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NFC
|
|
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GPS
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|
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FM Radio
|
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